Aluminum Foil Thermal Nanoplate Nano Thermal Insulation Board
MechHub is a brand synonymous with innovation, constantly pushing the boundaries of engine technology to deliver products that are both cutting-edge and reliable."
- Global Service
- Comprehensive Training
- Energy Efficiency
- Safety Features:
NEED ANY HELP?CLICK HERE
Product Description
Product Description
Nano thermal insulation board use lightweight, inorganic silica and ceramic fibers with low thermal conductivity are used as raw materials, and aluminum foilwith high reflectivity is used as the underlying material. The single-layer composite structure is formed by continuous coatingand composite pressing process, and its thermal conductivity is higher than that of static The air is smaller, and the thermalinsulation performance is about 3 to 5 times better than that of traditional thermal insulation materials. t is the best thermalinsulation material so far.
Features Of Nano Insulation Board
- High temperature resistance - long-term use temperature of 400 ~ 1000 degreesd
- Thermal conductivity - 2 ~ 10 times lower than the conventional thermal insulation material, 800 degrees only 0.052 w / m k
- Durability - can be used as a permanent layer of insulation, service life of more than 5 ~ 10 years
- Safety and environmental protection - pure non-polar material combination, good thermal stability, no release of any harmful substances
- Economic analysis - the price is lower than 50 % of similar products abroad, 10 ~ 30 % energy saving than conventional materials
Applications Of Nano Insulation Board
- Nonferrous Metal Furnace
- Rotary & Shaft Kiln
- Various Incinerator
- Reheating Furnace
- Permanent Lining For EAF Ladle
- General Industrial Furnace etc.
Physical And Chemical Indicators Of Nano Insulation Board
Product Name |
Nano heat shield |
Inspection Standard |
|
Product code |
LC-900/1000/1100 |
||
Melting point |
≥1200ºC |
||
Usage temperature |
900ºC-1100ºC |
||
Density (±10%) |
320kg/m3 | GB/T17911-2006 | |
Specific heat capacity(400ºC) |
0.8kJ/kg.k | T4130-2005 | |
Compressive strength ( compression 10 % ) |
0.3MPa | GB/T 13480-1992 | |
Linear Shrinkage(800ºC) |
2.0% | GB/T17U911-2006 | |
Thermal conductivity(w/m.k) |
70ºC |
0.019 | T4130-2005 |
200ºC |
0.021 | ||
400ºC |
0.024 | ||
600ºC |
0.031 | ||
800ºC |
0.040 |
Product Pictures Of Nano Insulation Board